Today, REWA LAB will separate the iPhone 12 motherboard, demo break and recombination procedure process This video will give you a thorough analysis of the structure and restore predicaments Lift the screen with Suction Cup Disconnect the battery Pry up the ear speaker flex cable, parade flex cable, and touch flex cable Disconnect other flex cables on the motherboard Remove screwings on the motherboard Detach the motherboard and the Face ID module The iPhone 12 in our hand is not U.S. version As its 5G system frequency strip adopts the Sub-6G, there are primarily three feelers attachment accommodates( upper antenna, NFC antenna, and lower antenna) By differ, the U.S.Version iPhone will boast an extra mmWave antenna while the motherboard will have an additional mmWave antenna connector seat In addition to differences in outer look, the layout of the three motherboards is also different. The motherboard of iPhone 12 is placed on the left while the motherboard of iPhone 11 and iPhone 11 Pro is placed on the right As the new iPhone 12 lineup necessary the baseband and chipping of 5G to be added to the motherboard, Apple may need to redesign the motherboard and its organization Next, let’s take a look at the break-up of the iPhone 12 double-stacked motherboard Remove the foam on the motherboard with tweezers Then make the sticker around the motherboard off Heat the motherboard with Hot Air Gun at 180 Remove the plastic side Put the motherboard on the Heating Platform Since the heating platform for iPhone 12 has not come out yet, we adopt the universal heating platform Please notice that it requires two beings to separate the motherboard now Besides, since the middle-of-the-road blanket of the iPhone 12 motherboard implements middle-temperature tin soldering that differs from the low-temperature tin adopted in iPhone 11 Pro, the temperature of the heating stage needs to be adjusted to 200 When the temperature reaches 200, heat the leading edge of the motherboard with rotational aura( QUICK 861 D Hot Air Gun at 320) Please be noted that unwarranted heating may lead to pseudo soldering or falling off of parts Two rounds of vertical heating are advisable Pry up the logic committee Remove the logic timber and signal card Attach the signal board to the PCB Holder Remove the thermal grease To cleanse the tin on the bonding pad, smear rosin with Soldering Iron at 400 and solder-wick The middle layer of the motherboard expends middle-temperature tin soldering, which concludes it harder to clean than the low-temperature tin Clean the bonding pad with PCB Cleaner Handle the logic card in the same way As we mentioned under our previous video, the motherboard of the iPhone 12 and iPhone 12 Pro is almost identical in appearance with the double-stacked soldering The sole inconsistency is that the join one of the purposes of the LiDAR Scanner on the iPhone 12 motherboard has no stuff Beyond that, we can see two empty-bellied percentages on the reasoning card after break The two parts are additionally reserved for the Camera PMU2 and LiDAR PMU on the iPhone 12 Pro motherboard The A14 chip nanometer process, which develops from the A13 chip, leads from 7nm to 5nm As the first 5-nanometer chip in the industry, A14 Bionic is faster than every other smartphone chip With A1 4 Bionic, the CPU, GPU, and machine learning cleverness of iPhone 12 lineup further improved greatly Harmonizing to Bloomberg, Apple is said to face shortages in power microchips for iPhone 12 Power management is more important in the iPhone 12 than for its predecessors given additional camera features and 5G capabilities, increasing Apple’s need for these components The SIM card slot of the iPhone 12 series endorses a stand-alone intend which is connected via flex cable In case of any blame related to the card slot during repair, you only need to replace the stand-alone card slot For likenes, the iPhone 11 placard slot is also connected to the motherboard via flex cable, but it is embedded on the motherboard for iPhone 11 Pro Series The lightning connector flex cable of iPhone 11 Pro integrates Bot Speaker IC, ARC Vibrator IC, Charging IC, and Wireless Charging IC, which increases the possibility of functional flop in the instances of irrigate shattering or ponderous die But these ICs are back on the iPhone 12 motherboard, which is not simply shortens the possibility of lightning connector functional los but too does it easier to restore in the instances of liquid damage or heavy drop-off Take the Face ID parts of iPhone 12 and iPhone 11 Pro to compare In appearance, the iPhone 12 Face ID front camera module seems much the same as the previous iPhone 11 serials, with some changes to the metal enclose and flex cable The layout of the infrared camera, breast camera, and scattered projector remains unchanged It is apparent from the microscope and camera lens that the flood illuminator module at the ear loudspeaker flex cable is different The lighting area of the iPhone 12 inundate illuminator is larger Then we recombine the logic card and signal council Attach the signal board to the Reballing Platform Put the Reballing Stencil in position Apply some middle-temperature solder paste Wipe residual solder adhesive with lint-free wiper Heat the signal timber with the Heating Platform at 200 After the solder ball is formed, turn the influence off and cool the motherboard for five minutes Apply some Paste Flux to the bonding pad evenly Align the reasoning timber with the signal committee Keep heating at 200 after the alignment Heat along the edge of the motherboard with Hot Air Gun at 320 Let the motherboard cool for 5 minutes Install the motherboard Connect the flex cables and screen Boot up and measure The phone turns on normally The above is the separation of the iPhone 12 motherboard Further, we utilized the 3D Scanner App to experience the LiDAR Scanner of iPhone 12 Pro Now please feast your eyes on our working stage with the LiDAR Scanner REWA LAB will continue to work harder Please bide aria, thank you!
